General Photosensitive ResinGeneral Photosensitive Resin
General Photosensitive Resin
High hardness and toughness
Print assemblies
Smooth surface details
Technical Parameters
Technical Parameters
model W963P
color white
Density (g/cm3 @ 25 ℃) 1.13
Curing depth (mm) 0.141
Critical Exposure (mJ/cm2) 7.3
Construction layer thickness (mm) 0.1
Hardness (D) 82
Flexural modulus (MPa) 2,492-2,550
Bending strength (MPa) 71- 75
Tensile modulus (MPa) 2,431-2,545
Tensile strength (MPa) 41-55
elongation at break 7 -10%
Notched impact strength (J/m) 27- 37
Heat distortion temperature (°C) 52~63
Glass transition temperature (°C) 55~68
Consultation
Sample application
Sample application
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